809 is a VOC-Free, Low solids, halide-free organic no-clean formulation designed for wave-soldering conventional and SMT boards assemblies. This formula is free from VOC’s (volatile organic compounds) with a vapour pressure higher than 0.1mm Hg @ 20 ºC – a guideline for VOC’s solvents.

809 is formulated to maximize and enhanced solderability as priority with minimal post-soldering residue which is non-conductive, non-corrosive and does not need to be removed as compared to normal watersoluble fluxes.