# 7130 is a specially developed halides-free, M-Pyrol and phosphates-free alkaline-based aqua immersion soaking solution for loosening of molded microelectronic package’s leads shoulder mold-flashes prior solder-dipping or solder plating process.
Typically, most mold-bleeds will be softened and swelled under this condition-soak 18.0 minutes at (80-85)°C. # 7130 has a high boiling point and the evaporation rate during operation is very low compared to most deflashing chemicals in the market. This formulation is non-toxic, non-corrosive and is 100% miscible in water.
|
|
|
|
| specifications︰ | Appearance Bluish Solution
Specific Gravity @25C 1.048
pH 10.0-10.5
Biodegradability (BOD28) 100 %
|
| Advantages︰ | • Halide-free, 100% water miscible
• Contains no N-Methyl-2-pyrrolidone
• Fast loosening of mold bleeds/flashes
• Will not attacks plastic package or lead-frame substrate material
|
|
|
|
